
- Infineon Launches Third-Generation XENSIV™ 3D Magnetic Hall Sensors for Automotive, Industrial, and Consumer Applications
- Jul 11,2025

- Infineon Expands Its Secure Authentication Portfolio with New ID Key S USB Token
- Jul 10,2025

- Lenovo and Intel Redefine the AI PC Experience with New Aura Edition Lineup
- Jul 04,2025

- TDK Expands TFM201612BLEA Series of Thin-Film Power Inductors for Automotive Applications with 5.6A Rated Current Models
- Jul 02,2025

- TDK Launches IAM-20680HV: A High-Performance, Cost-Effective Six-Axis IMU for Automotive Applications
- Jun 27,2025

- TDK Expands C Series MLCCs with Industry-Leading 100V, 1μF Capacitor in 1608 Size
- Jun 26,2025

- Melexis Introduces MLX90427: A Cost-Effective, High-Performance Magnetic Position Sensor for Next-Gen Joysticks and HMI Applications
- Jun 20,2025

- Microchip Expands dsPIC33A Family to Power High-Precision, Secure, Real-Time Embedded Applications
- Jun 19,2025

- Infineon Reaches 10 Billion Unit Milestone with Integrity Guard–Based Secure Controllers; Introduces New 32-Bit TEGRION™ SLC27G
- Jun 13,2025

- Infineon integrates CAPSENSE™ into PSOC™ HV microcontrollers for smart sensors and actuators including advanced touch sensing applications
- Jun 12,2025

- Intel Expands Xeon 6 Lineup to Power Next-Generation GPU-Accelerated AI Systems
- Jun 06,2025

- Acer Medical’s AI Tools Transform Eye and Bone Disease Screening Across Asia
- Jun 04,2025