TLV271QDBVRQ1 Texas Instruments IC OPAMP GP 3MHZ RRO SOT23-5

label:
2023/09/18 82



CATALOG
TLV271QDBVRQ1 COUNTRY OF ORIGIN
TLV271QDBVRQ1 PARAMETRIC INFO
TLV271QDBVRQ1 PACKAGE INFO
TLV271QDBVRQ1 MANUFACTURING INFO
TLV271QDBVRQ1 PACKAGING INFO
TLV271QDBVRQ1 ECAD MODELS


COUNTRY OF ORIGIN
Thailand


PARAMETRIC INFO
Manufacturer Type Low Power Amplifier
Type Low Power Amplifier
Rail to Rail Rail to Rail Output
Minimum Single Supply Voltage (V) 2.7
Number of Channels per Chip 1
Process Technology CMOS
Typical Single Supply Voltage (V) 3|5|9|12|15
Maximum Single Supply Voltage (V) 16
Output Type CMOS
Minimum Dual Supply Voltage (V) ±1.35
Typical Gain Bandwidth Product (MHz) 3
Maximum Input Offset Voltage (mV) 5@5V
Typical Dual Supply Voltage (V) ±3|±5
Maximum Input Offset Current (uA) 0.00006@15V
Maximum Dual Supply Voltage (V) ±8
Maximum Operating Supply Voltage (V) ±8|16
Maximum Input Bias Current (uA) 0.00006@15V
Minimum CMRR (dB) 58
Maximum Supply Voltage Range (V) 16 to 17
Minimum CMRR Range (dB) 50 to 60
Typical Voltage Gain (dB) 110
Typical Slew Rate (V/us) 2.4@5V
Typical Settling Time (ns) 2000
Typical Output Current (mA) 8@5V
Typical Input Noise Voltage Density (nV/rtHz) 39@5V
Typical Noninverting Input Current Noise Density (pA/rtHz) 0.0006@5V
Typical Input Bias Current (uA) 0.000001@15V
Shut Down Support No
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 125
Supplier Temperature Grade Automotive
Power Supply Type Single|Dual
Maximum Supply Current (mA) 0.66@5V
Maximum Power Dissipation (mW) 201


PACKAGE INFO
Supplier Package SOT-23
Basic Package Type Lead-Frame SMT
Pin Count 5
Lead Shape Gull-wing
PCB 5
Tab N/R
Pin Pitch (mm) 0.95
Package Length (mm) 3.05(Max)
Package Width (mm) 1.75(Max)
Package Height (mm) 1.1
Package Diameter (mm) N/R
Package Overall Length (mm) 3.05(Max)
Package Overall Width (mm) 3(Max)
Package Overall Height (mm) 1.45(Max)
Seated Plane Height (mm) 1.45(Max)
Mounting Surface Mount
Package Weight (g) N/A
Package Material Plastic
Package Description Small Outline Transistor
Package Family Name SOT
Jedec MO-178AA
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL 1
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Standard J-STD-020D
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Lead Finish(Plating) Au
Under Plating Material Pd over Ni
Terminal Base Material Cu Alloy


PACKAGING INFO
Packaging Suffix R
Packaging Tape and Reel
Quantity Of Packaging 3000
Reel Diameter (in) 7
Tape Pitch (mm) 4
Tape Width (mm) 8
Component Orientation Q3
Packaging Document Link to Datasheet


ECAD MODELS



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